Aluminum Alloy Ventilated Raised Access Floor

Designed for data centers and server rooms with stable load and electrostatic control.

Aluminum Alloy Ventilated Raised Access Floor

Materials:aluminum

Size:600×600×55mm、600×600×50mm

Installation:Four-corner support type

Finish:HPL/PVC

Purpose:Regulate airflow and maintain environmental stability

Features:High-grade cleanroom, dust-free chamber, microelectronic chip

Edging:Fold edging / Cut edging

Aluminum Perforated Raised Access Floor is made of high strength and pure cast aluminum. It is a precision-crafted flooring system that features perforations in the panels to facilitate controlled air circulation.


Aluminum die-cast ventilated raised access flooring is a specialized flooring system designed for environments requiring strict cleanliness, such as cleanrooms, to facilitate controlled air circulation. This system utilizes precision-manufactured aluminum panels, ensuring maximum uniformity and durability through the die-casting process.
The perforated design enables directed airflow, aiding in temperature regulation and particle control. This structure provides equipment installation space beneath the floor while offering efficient airflow distribution—particularly critical in high-heat or contamination-prone areas.

Project DetailFinishSystem ResistanceMaterialConcentrated LoadUltimated LoadUniform LoadSpecial Treatment
DAF300HPL/PVCConductive 1O4-1O6Ω or Static Dissipative 1O6-1O9ΩDie-cast aluminum300kgf/6.45cm2 Deflection<=2.0mm600kgf/6.45cm2600kgf/m2
Deflection<=1.0mm
Epoxy coating or
Ni-Cr plating
DAF500HPL/PVCConductive 1O4-1O6Ω or Static Dissipative 1O6-1O9ΩDie-cast aluminum500kgf/6.45cm2 Deflection<=2.0mm1000kgf/6.45cm21000kgf/m2
Deflection<=1.0mm
Epoxy coating or
Ni-Cr plating
DAF700HPL/PVCConductive 1O4-1O6Ω or Static Dissipative 1O6-1O9ΩDie-cast aluminum700kgf/6.45cm2 Deflection<=2.0mm1400kgf/6.45cm21400kgf/m2
Deflection<=1.0mm
Epoxy coating or
Ni-Cr plating
DAF1000HPL/PVCConductive 1O4-1O6Ω or Static Dissipative 1O6-1O9ΩDie-cast aluminum1000kgf/6.45cm2 Deflection<=2.0mm2000kgf/6.45cm22000kgf/m2
Deflection<=1.0mm
Epoxy coating or
Ni-Cr plating
DAF1200HPL/PVCConductive 1O4-1O6Ω or Static Dissipative 1O6-1O9ΩDie-cast aluminum1200kgf/6.45cm2 Deflection<=2.0mm2400kgf/6.45cm22200kgf/m2
Deflection<=1.0mm
Epoxy coating or
Ni-Cr plating
DAF1500HPL/PVCConductive 1O4-1O6Ω or Static Dissipative 1O6-1O9ΩDie-cast aluminum1500kgf/6.45cm2 Deflection<=2.0mm3000kgf/6.45cm23000kgf/m2
Deflection<=1.0mm
Epoxy coating or
Ni-Cr plating
DAF2000HPL/PVCConductive 1O4-1O6Ω or Static Dissipative 1O6-1O9ΩDie-cast aluminum2000kgf/6.45cm2 Deflection<=2.0mm4000kgf/6.45cm24000kgf/m2
Deflection<=1.0mm
Epoxy coating or
Ni-Cr plating
DAF2500HPL/PVCConductive 1O4-1O6Ω or Static Dissipative 1O6-1O9ΩDie-cast aluminum2500kgf/6.45cm2 Deflection<=2.0mm5000kgf/6.45cm25000kgf/m2
Deflection<=1.0mm
Epoxy coating or
Ni-Cr plating
DAF3000HPL/PVCConductive 1O4-1O6Ω or Static Dissipative 1O6-1O9ΩDie-cast aluminum3000kgf/6.45cm2 Deflection<=2.0mm6000kgf/6.45cm26000kgf/m2
Deflection<=1.0mm
Epoxy coating or
Ni-Cr plating
  • Raised Access Floor design load is tested using CISCA Concentrated Load test method on actual understructure instead of steel blocks. The design load is determined by taking the lesser value of the ultimate load divided by two or the point at which permanent damage occurs (yield point).
  • The Raised Access Floor safety factor is the multiple of Design load to the Ultimate Load. International standards and bonaway recommend’ a minium of 2.
Features

1. Manufactured from high-strength pure cast aluminum;
2. Electrostatic powder coating on base surface provides a matte finish, wear resistance, corrosion protection, and excellent durability;
3. High-efficiency fireproofing and anti-static properties;
4. High dimensional accuracy, excellent interchangeability, simple installation, and easy maintenance.
5. Generous underfloor space facilitates installation and maintenance of power/data cables and various pipelines

Application Areas
It is mainly used in high grade clean workshop, dust-free room, semiconductor, microelectronics chip, communication equipment, biochemical factory and other clean environment, dust proof, anti-static, pipeline laying centralized all kinds of data center room with down air supply device and other places.

 

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